Material-Integrated Intelligent Systems

Technology and Applications

Edited by Stefan Bosse Edited by Dirk Lehmhus Edited by Walter Lang Edited by Matthias Busse

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Extent: 696 pages

Publisher: Wiley-VCH

Language: English

Hardback (Published)

(January 2018)

ISBN: 9783527336067

6.69 x 9.61 inches

Price: $362.00

On back order

Combining different perspectives from materials science, engineering, and computer science, this reference provides a unified view of the various aspects necessary for the successful realization of intelligent systems.

The editors and authors are from academia and research institutions with close ties to industry, and are thus able to offer first-hand information here. They adopt a unique, three-tiered approach such that readers can gain basic, intermediate, and advanced topical knowledge. The technology section of the book is divided into chapters covering the basics of sensor integration in materials, the challenges associated with this approach, data processing, evaluation, and validation, as well as methods for achieving an autonomous energy supply. The applications part then goes on to showcase typical scenarios where material-integrated intelligent systems are already in use, such as for structural health monitoring and smart textiles.

SENSOR AND ELECTRONICS DEVELOPMENT FOR MATERIAL INTEGRATION
Function Scale Integration - The Concept of Limiting Wounds to Materials Induced by Sensor Integration
Development of New Types of Sensors Specifically Addressing Host Material Integration Aspects
Compliant Sensor and Electronics Technology
Techniques for Integrating Sensors with Materials: Bulk and Surface Integration
INTERFACING TECHNOLOGIES
Electrical and Optical Connectivity
Bonding Techniques
Printing Techniques for Interfacing Structures
RELIABLE DATA PROCESSING PROVIDING ROBUSTNESS
AI Methods for Data Evaluation
Networking with Distributed Data Processing
Sensor Signal Processing: Sensor Data Fusion
RELIABLE COMMUNICATION PROVIDING ROBUSTNESS
Communication Protocols on Link and Application Layer: Hard- and Software Side
Communication on Physical Layer: Hardware Side, Physical Realization
ENERGY SUPPLY
Distribution, Management, Harvesting and Storage of Energy
Low-Power Electronics for Signal and Data Processing
APPLICATIONS
Smart Skin
Structural Health Monitoring
Body Area Networks
Smart Textiles
Casttronics
Metacomposites Programming

  • Edited by Stefan Bosse
  • Edited by Dirk Lehmhus
  • Edited by Walter Lang
  • Edited by Matthias Busse